Grounding and bonding kits shall bond each rack to secondary bonding busbar (SBB) also known as telecommunications grounding busbar (TGB) using telecommunications equipment bonding conductor (TEBC). Hardware kit shall bolt TEBC to SBB/TGB with 1/4 in stainless steel hardware. Each bolt requires a nut, flat washer on both sides, and a blleville washer on the bolt side of the stack up. TEBC shall be bolted to rack with #12-24 thread forming screws. Abrasive cleaning pad shall remove oxidation from lug and mounting surfaces. Copper to copper joint compound shall also be utilized to prep lug mounting surfaces. The front and back of each rack requires one ESD port kit and ESD wrist strap. Bond SBB/TGB to electrical panel serving equipment in telecommunications room.