RGCBNJ660P22 StructuredGround Equipment Bonding Jumper Kit, Copper
- MFR:
- Panduit
- MFR #:
- RGCBNJ660P22
- UPC:
- 074983798636
- Item #:
- 196838
RGCBNJ660P22 StructuredGround Equipment Bonding Jumper Kit, Copper
- MFR #:
- RGCBNJ660P22
- UPC:
- 074983798636
- Item #:
- 196838
Availability
| Location | Available Qty |
|---|---|
| Available | Available to Order |
$100.23
each
The RGCBNJ660P22 Equipment Bonding Jumper Kit bonds the rack or cabinet to the subfloor or overhead building grounding system. Engineered to comply with US and International grounding requirements. HTAP is UL Listed and CSA Certified for applications up to 600 V when crimped with Panduit and specified competitor crimping tools, and Panduit crimping dies. Color Green/Yellow.
Manuals and Documentation
| Catalog Number | RGCBNJ660P22 |
| Manufacturer | Panduit |
| Brand | Panduit |
| Country of Origin | United States |
| Made in USA | Yes |
| Application | Telecom/Data Center |
| Standard | UL and CSA |
| UPC | 074983798636 |
| GTIN | 00074983798636 |
| Item Type | Equipment Bonding Jumper Kit |
| Length | 60 |
| Length UOM | Inch |
| Size | #6 |